µCom-10Gb+ series (pronounced Microcom) is the latest connector offering from Amphenol focused on the latest market trends of the industry: miniaturization and high speed. µCom-10Gb+'s design of four twisted data pairs insulated throughout the entire connector results in a performance that exceeds IEEE 802.3an-2006 specifications for 10GBASE-T Ethernet and TIA/EIA-568-C.2 Cat.6A standards. Designed to be in conformance with MIL-DTL-810F environmental requirements, µCom-10Gb+ 15 mm shell size and 2000 mating-cycle coupling provide end users with one of the most rugged and micro-sized interconnect solutions on the market.
Video: Rugged Solutions Series I, Episode 6/7: MicroCom
| Features and Benefits |
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- 10Gb+ exceeds 10 GB/s Ethernet following IEEE 802.3an-2006: 10GBase-T
- Cat.6A connector according to TIA568C.2 and ISO/IEC11801 standard
- Environmental testing based on MIL-DTL-38999 series III military specifications
- Miniature: 15 mm (.59 ̋) max external diameter
- Four pairs totally insulated throughout the connector
- Minimum cross-talk between the four pairs
- Patent-pending special interfacial shapes
- Minimum perturbation at the interface of each pair
- Thread-coupling mechanism
- 2000 mating cycles and high vibration resistance
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- Machined brass shells and RoHS compliant plating
- Shell-to-shell continuity and 500h salt spray resistance
- Machined and gold-plated solder and crimp contacts
- Design and performance according to the innercontact of M39029/77-429#16 M39029/76-425#16 38999 contact
- Solder contact : max AWG24
- Crimp contact : AWG 24 to 26
- P68 sealing mated and unmated for receptacles
- 1500 VRMS dielectric withstanding voltage
- Temperature range: -55°C / +125°C
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| Applications |
- Defense
- C4|SR
- Battlefield communications
- Shipboard
- Ground vehicle vetronics
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- Aeronautical
- In-flight entertainment
- Avionics
- Communication systems
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- Rail mass transit
- Passenger information systems
- Communication systems
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