Octavo Systems' OSD335x family of SiP products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD335x integrates the AM335x along with the TI TPS65217C PMIC and TI TL5209 LDO, up to 1 GB of DDR3 memory, and over 140 resistors, capacitors, and inductors all into a single design-in-ready package.
With this level of integration the OSD335x family of SIPs allows designers to focus on the key aspects of their system without spending time on the complicated high-speed design of the processor/DDR3 interface. It also reduces the overall size and complexity of the design. The OSD335x can significantly decrease the time to market for AM335x-based products.
OSD335x Block Diagram
Features |
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- TI AM335x features:
- ARM® Cortex®-A8 up to 1GHz
- 8-channel 16-bit SAR AD
- Ethernet 10/100/1000 x 2
- USB 2.0 HS OTG + PHY x2
- MMC, SD, and SDIO x2
- LCD controller and 3D graphics engine
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- TI AM335x, TPS65217C, TL5209, DDR3, and over 140 passive components integrated into a single package
- Access to all AM335x GPIOs and peripherals
- Up to 1 GB DDR3
- PWR in from 5 VDC, USB, or Li-Ion battery
- PWR out: 1.8 V, 3.3 V, and Sys
- 400 ball 1.27 mm pitch BGA (20 x 20)
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Benefits |
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- Integrates over 140 components into one
- Compatible with AM335x development tools and software
- Wide BGA ball pitch allows for low-cost assembly.
- Significantly reduces design time
- Decreases layout complexity
- Saves board space
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- Increased reliability through reduced number of components
- Power savings and increased performance
- Shorter signal trace lengths
- Reduced parasitics
- 27 mm x 27 mm package size
- Temperature range: 0°C to +90°C or -40°C to +85°C
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