Bosch’s BMM150 is a low-power and low-noise, 3-axis, digital geomagnetic sensor to be used in compass applications. The 12-pin wafer level chip-scale package (WLCSP) with a footprint of 1.56 mm² x 1.56 mm² and 0.60 mm height provides high design flexibility to a developer of mobile devices. Applications like virtual reality or gaming on mobile devices such as mobile phones, tablet PCs, or portable media players require 9-axis inertial sensing including magnetic heading information.

The Bosch Sensortec BMM150 shuttle-board is a PCB with a BMM150 geomagnetic sensor mounted on it. It allows easy access to the sensors pins via a simple socket. As all Bosch Sensortec sensor shuttle boards have an identical footprint, they can be plugged into Bosch Sensortec’s advanced development tools (such as the development board or application board). Of course, the BMM150 shuttle board can also be used for the users own implementations.