669-33ABT3

669-33ABT3
Mfr. #:
669-33ABT3
製造商:
Wakefield-Vette
描述:
Heat Sinks SpeedClip Heat Sink Assembly for Intel IDX4, AMD; 17x17 SPGA
生命週期:
製造商新產品
數據表:
669-33ABT3 數據表
交貨:
DHL FedEx Ups TNT EMS
支付:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
669-33ABT3 Datasheet
ECAD Model:
產品屬性
屬性值
製造商:
韋克菲爾德-維特
產品分類:
散熱片
品牌:
韋克菲爾德-維特
產品類別:
散熱片
子類別:
散熱片
Tags
669-3, 669
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
BOARD LEVEL HEAT SINK - SPEEDCLIP HEAT SINK ASSEMBLY FOR INTEL IDX4, AMD; 17X17 SPGA
***i-Key
HEATSINK ASSY FOR SPGA
***hardson RFPD
BOARD LEVEL HEAT SINK
圖片 型號 描述
669-33ABT3

Mfr.#: 669-33ABT3

OMO.#: OMO-669-33ABT3

Heat Sinks SpeedClip Heat Sink Assembly for Intel IDX4, AMD; 17x17 SPGA
669-3-R100KD

Mfr.#: 669-3-R100KD

OMO.#: OMO-669-3-R100KD-1190

全新原裝
可用性
庫存:
Available
訂購:
5500
輸入數量:
669-33ABT3的當前價格僅供參考,如果您想獲得最優惠的價格,請提交查詢或直接發送電子郵件至我們的銷售團隊[email protected]
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