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66AK2E05XABDA25

66AK2E05XABDA25
Mfr. #:
66AK2E05XABDA25
描述:
Digital Signal Processors & Controllers - DSP, DSC Edison 2 ARM, 4 DSP, 1.25Ghz ext temp
生命週期:
製造商新產品
數據表:
66AK2E05XABDA25 數據表
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更多信息:
66AK2E05XABDA25 更多信息 66AK2E05XABDA25 Product Details
產品屬性
屬性值
製造商：
恩智浦
產品分類：
數字信號處理器和控制器 - DSP、DSC
RoHS：
Y
安裝方式：
貼片/貼片
包裝/案例：
QFP-32
系列：
56F801x
產品：
DSC
核：
56800E
最大時鐘頻率：
32 MHz
程序內存大小：
16 kB
數據內存大小：
4 kB
工作電源電壓：
2.5 V
最低工作溫度：
- 40 C
最高工作溫度：
+ 125 C
打包：
托盤
高度：
1.45 mm
長度：
7 mm
程序存儲器類型：
閃光
寬度：
7 mm
品牌：
恩智浦/飛思卡爾
接口類型：
I2C, LIN, SCI, SPI
I/O 數量：
26 I/O
ADC分辨率：
12 bit
數據總線寬度：
16 bit
濕氣敏感：
是的
定時器/計數器的數量：
1 Timer
產品類別：
DSP - 數字信號處理器和控制器
出廠包裝數量：
1250
子類別：
嵌入式處理器和控制器
電源電壓 - 最大值：
3.6 V
電源電壓 - 最小值：
3 V
第 # 部分別名：
935310004557
單位重量：
0.006653 oz
Tags
66AK2E05, 66AK2E, 66AK2, 66AK, 66A
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***as Instruments
Multicore DSP+Arm, 4x Arm A15 cores, 1x C66x DSP core, NetCP, 10GbE switch 1089-FCBGA -40 to 100
***et
Multicore DSP+ARM KeyStone II System-on-Chip (SoC)
***ark
Edison 2 Arm, 4 Dsp, 1.25Ghz Ext Temp
***AS INSTUMENTS
The 66AK2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor single-core or quad-core CorePac and C66x DSP core, that can run at a core speed of up to 1.4 GHz. TI’s 66AK2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.
***AS INSTUMENTS
TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), C66x CorePac, network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.
***as Instruments (TI)
TI’s C66x core launches a new era of DSP technology by combining fixed-point and floating point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). It can execute 8 single precision floating point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE754 compliant. For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64×+ cores. The C66x CorePac incorporates 90 new instructions targeted for floating point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backwards code compatible with TI'’s previous generation C6000 fixed and floating point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.
***as Instr.
The 66AK2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. In the DSP CorePac, in addition to 32KB of L1 program and 32KB of L1 data cache, there is 512KB of dedicated memory per core that can be configured as cache or as memory mapped RAM. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.
***AS INSTRUM
The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.
Processors
OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.
66AK2E05 Multicore DSP+ARM Keystone II SoC
OMO Electronic 66AK2E05 Multicore DSP+ARM Keystone II System on Chip (SoC) is a high-performance device with multicore SoC architecture. This SoC features quad-core ARM Cortex-A15 processors, 2MB of Multicore Shared Memory Controller (MSMC), and TMS320C66x DSP core subsystem. The 66AK2E05 SoC integrates a large amount of on-chip memory and includes a 64bit DDR3 external memory interface. This Keystone II SoC enables to use a variety of development and debugging tools including open source Linux debugging environment. The ideal end equipment includes CT scanner, embedded PC, network attached storage, oscilloscope, X-ray, and ethernet switch. The 66AK2E05 offers 0°C to 85°C of the commercial case temperature and -40°C to 100°C of extended case temperature. Typical applications include consumer electronics, medical, security, space, communication, avionics, and defense.
型號 描述 庫存 價格
66AK2E05XABDA25
DISTI # 66AK2E05XABDA25-ND		66AK2E05XABDA25
RoHS: Compliant
Min Qty: 40
Container: Tube		Temporarily Out of Stock
  • 40:$154.1110
66AK2E05XABDA25
DISTI # 66AK2E05XABDA25		Multicore DSP+ARM KeyStone II System-on-Chip (SoC) - Trays (Alt: 66AK2E05XABDA25)
RoHS: Not Compliant
Min Qty: 40
Container: Tray		Americas - 0
  • 40:$193.3900
  • 80:$188.6900
  • 160:$181.2900
  • 240:$176.8900
  • 400:$173.6900
66AK2E05XABDA25
DISTI # 595-66AK2E05XABDA25		Digital Signal Processors & Controllers - DSP, DSC Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1089-FCBGA -40 to 100
RoHS: Compliant		0
  • 1:$164.5400
  • 5:$162.2100
  • 10:$157.5800
  • 25:$156.4300
圖片 型號 描述
TMDSEMU560V2STM-UE

Mfr.#: TMDSEMU560V2STM-UE

OMO.#: OMO-TMDSEMU560V2STM-UE

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OMO.#: OMO-TMDSEMU200-U-TEXAS-INSTRUMENTS

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TMDSEMU560V2STM-U

Mfr.#: TMDSEMU560V2STM-U

OMO.#: OMO-TMDSEMU560V2STM-U-TEXAS-INSTRUMENTS

 EMULATOR TRACE SYSTEM USB
TMDSEMU560V2STM-UE

Mfr.#: TMDSEMU560V2STM-UE

OMO.#: OMO-TMDSEMU560V2STM-UE-TEXAS-INSTRUMENTS

 EMULATOR TRACE SYSTEM XDS560
可用性
庫存:
Available
訂購:
2000
輸入數量:
66AK2E05XABDA25的當前價格僅供參考，如果您想獲得最優惠的價格，請提交查詢或直接發送電子郵件至我們的銷售團隊[email protected]
參考價格（美元）
數量
單價
小計金額
1
US$164.54
US$164.54
5
US$162.21
US$811.05
10
US$157.58
US$1 575.80
25
US$156.43
US$3 910.75
由於2021年半導體供不應求，低於2021年之前的正常價格，請發詢價確認。
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