3372-1202

3372-1202
Mfr. #:
3372-1202
製造商:
3M
描述:
Headers & Wire Housings 60/HDR/3W/ RA/SL/ .112/30AVG/60:40
生命週期:
製造商新產品
數據表:
3372-1202 數據表
交貨:
DHL FedEx Ups TNT EMS
支付:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
產品屬性
屬性值
Tags
3372-1, 3372, 337
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
型號 製造商 描述 庫存 價格
3372-1202
DISTI # 3372-1202-ND
3M InterconnectCONN HEADER R/A 60POS 2.54MM
RoHS: Not compliant
Min Qty: 1050
Container: Bulk
Temporarily Out of Stock
  • 1050:$6.9426
N3372-1202RB
DISTI # N3372-1202RB-ND
3M InterconnectCONN HEADER R/A 60POS 2.54MM
RoHS: Compliant
Min Qty: 1050
Container: Bulk
Temporarily Out of Stock
  • 1050:$5.3978
N3372-1202RB
DISTI # 05111173135
3M InterconnectConn Ejector Header HDR 60 POS 2.54mm Solder RA Thru-Hole - Bulk (Alt: 05111173135)
RoHS: Compliant
Min Qty: 1050
Container: Bulk
Americas - 0
  • 10500:$3.6900
  • 5250:$4.9900
  • 3150:$5.1900
  • 2100:$5.2900
  • 1050:$5.4900
N3372-1202RB
DISTI # 34P5410
3M Interconnect80000910564 N3372-1202RB =60/HDR/SL/RA/HT/ .112/30AVG/ROHS0
  • 50000:$5.3400
  • 25000:$6.0600
  • 10000:$6.7600
  • 1:$8.9100
3372-1202
DISTI # 517-3372-1202
3M InterconnectHeaders & Wire Housings 60/HDR/3W/ RA/SL/ .112/30AVG/60:400
  • 1050:$6.9400
N3372-1202RB
DISTI # 517-N3372-1202RB
3M InterconnectHeaders & Wire Housings 60/HDR/SL/RA/HT/ .112/30AVG/ROHS0
  • 1050:$5.4000
圖片 型號 描述
3372-6002

Mfr.#: 3372-6002

OMO.#: OMO-3372-6002

Headers & Wire Housings 60P STRT SOLDER TAIL
3372-5202

Mfr.#: 3372-5202

OMO.#: OMO-3372-5202

Headers & Wire Housings 60 PIN 3WALL RT ANG SHORT ROLL PIN
3372-5303

Mfr.#: 3372-5303

OMO.#: OMO-3372-5303

Headers & Wire Housings 60P HEADER
3372-6305

Mfr.#: 3372-6305

OMO.#: OMO-3372-6305

Headers & Wire Housings 60/HDR/BX/ STR/LL/ WWT/30AVG/100 BX
3372-D302

Mfr.#: 3372-D302

OMO.#: OMO-3372-D302-3M

Headers & Wire Housings 120P 3 WL CONDO HDR RA LNG EJECTORS
3372-6005

Mfr.#: 3372-6005

OMO.#: OMO-3372-6005-3M

Headers & Wire Housings 60/HDR/BX/STR WWT/30G/100BX
3372-1302

Mfr.#: 3372-1302

OMO.#: OMO-3372-1302-410

Headers & Wire Housings BOARDMOUNT HEADER
3372V

Mfr.#: 3372V

OMO.#: OMO-3372V-1190

全新原裝
33724

Mfr.#: 33724

OMO.#: OMO-33724-TE-CONNECTIVITY

Terminals RING 16-14AWG #6
33722

Mfr.#: 33722

OMO.#: OMO-33722-TE-CONNECTIVITY

Terminals RING 16-14AWG #10
可用性
庫存:
Available
訂購:
3500
輸入數量:
3372-1202的當前價格僅供參考,如果您想獲得最優惠的價格,請提交查詢或直接發送電子郵件至我們的銷售團隊[email protected]
參考價格(美元)
數量
單價
小計金額
1
US$10.41
US$10.41
10
US$9.89
US$98.90
100
US$9.37
US$936.90
500
US$8.85
US$4 424.25
1000
US$8.33
US$8 328.00
由於2021年半導體供不應求,低於2021年之前的正常價格,請發詢價確認。
從...開始
最新產品
  • 588 Thermal Bonding Film
    3M™ 588 thermal bonding film is a high strength, flexible, nitrile phenolic based thermosetting adhesive film that is a thicker version of the 583 film.
  • Twin Axial Cables
    Available in four-channel, 100 Ω, 30 AWG versions, 3M™'s SL8800 series cable is the optimum solution for space-constrained systems.
  • D89 Series Socket Assemblies and 3365 Series Flat
    Digi-Key is expanding its extensive 3M™ value-added assembly program with ready-to-install IDC assemblies constructed with the D89 socket series.
  • Input/Output Interconnect System
    3M™'s I/O interconnect system allows designers flexibility in the location of power supplies to peripheral devices.
  • Mini Delta Ribbon Transmission Cable Assembly
    3M™'s MDR high-speed transmission system is a digital interconnect system designed to meet the needs of today's high-performance data transmission applications.
Top