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| PartNumber | 116-93-650-41-006000 | 116-93-650-41-001000 | 116-93-650-41-003000 |
| Description | IC & Component Sockets 50 PIN ELEVATED SKT .236L | IC & Component Sockets 50 PIN ELEVATED SKT .594L | IC & Component Sockets 50 PIN ELEVATED SKT .315L |
| Manufacturer | Mill-Max | Mill-Max Manufacturing Corp. | Mill-Max Manufacturing Corp. |
| Product Category | IC & Component Sockets | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
| RoHS | N | - | - |
| Series | 0116 | 116 | 116 |
| Packaging | Tube | Tube | Tube |
| Brand | Mill-Max | - | - |
| Product Type | IC & Component Sockets | - | - |
| Factory Pack Quantity | 8 | - | - |
| Subcategory | IC & Component Sockets | - | - |
| Type | - | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing |
| Termination | - | Solder | Solder |
| Operating Temperature | - | -55°C ~ 125°C | -55°C ~ 125°C |
| Mounting Type | - | Through Hole | Through Hole |
| Features | - | Elevated, Open Frame | Elevated, Open Frame |
| Housing Material | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Number of Positions or Pins Grid | - | 50 (2 x 25) | 50 (2 x 25) |
| Pitch Mating | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Mating | - | Gold | Gold |
| Pitch Post | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Post | - | Tin-Lead | Tin-Lead |
| Contact Finish Thickness Mating | - | 30μin (0.76μm) | 30μin (0.76μm) |
| Contact Material Mating | - | Beryllium Copper | Beryllium Copper |
| Contact Finish Thickness Post | - | 200μin (5.08μm) | 200μin (5.08μm) |
| Contact Material Post | - | Brass Alloy | Brass Alloy |