![]() | |||
| PartNumber | 264-1300-00-0602J | 264-1300-09-0602J | 264-130 |
| Description | IC & Component Sockets 0.070" DIP SOCKET 64 Contact Qty. | IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty. | Conn Terminal Block F 1 POS RA 23A Box |
| Manufacturer | 3M | 3M | 3M |
| Product Category | Sockets for ICs, Transistors | Sockets for ICs, Transistors - Adapters | Sockets for ICs, Transistors |
| Series | Textool | Textool | Textool |
| Type | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | - | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing |
| Packaging | Bulk | - | Bulk |
| Termination | Press-Fit | - | Press-Fit |
| Operating Temperature | -55°C ~ 125°C | - | -55°C ~ 125°C |
| Mounting Type | Connector | - | Connector |
| Features | Closed Frame | - | Closed Frame |
| Housing Material | Polysulfone (PSU), Glass Filled | - | Polysulfone (PSU), Glass Filled |
| Number of Positions or Pins Grid | 64 (2 x 32) | - | 64 (2 x 32) |
| Pitch Mating | 0.070" (1.78mm) | - | 0.070" (1.78mm) |
| Contact Finish Mating | Gold | - | Gold |
| Pitch Post | 0.070" (1.78mm) | - | 0.070" (1.78mm) |
| Contact Finish Post | Gold | - | Gold |
| Contact Finish Thickness Mating | 30μin (0.76μm) | - | 30μin (0.76μm) |
| Contact Material Mating | Beryllium Copper | - | Beryllium Copper |
| Contact Finish Thickness Post | 30μin (0.76μm) | - | 30μin (0.76μm) |
| Contact Material Post | Beryllium Copper | - | Beryllium Copper |
| Number of Pins | - | - | |
| Convert From Adapter End | - | - | - |
| Convert To Adapter End | - | - | - |
| Board Material | - | - | - |