 |  |  | |
| PartNumber | 8329TCM-50ML | 8329TCM-200ML | 8329TCF-50ML |
| Description | Thermal Interface Products EPOXY, MEDIUM CURE (RATIO 1:1) | Thermal Interface Products Thermally Conductive Two-Part, Medium Cure Epoxy Adhesive. | Fast Cure Thermally Conductive Adhesive |
| Manufacturer | MG Chemicals | - | - |
| Product Category | Thermal Interface Products | - | - |
| Shipping Restrictions | - | - | |
| RoHS | Y | - | - |
| Type | Thermally Conductive Adhesive | - | - |
| Material | Epoxy | - | - |
| Thickness | - | - | - |
| Series | 8329TCM | - | - |
| Breakdown Voltage | 29 kV | - | - |
| Color | Gray | - | - |
| Package / Case | Jar | - | - |
| Tensile Strength | 10 N | - | - |
| Brand | MG Chemicals | - | - |
| Maximum Operating Temperature | + 150 C | - | - |
| Minimum Operating Temperature | - 40 C | - | - |
| Product Type | Thermal Interface Products | - | - |
| Factory Pack Quantity | 1 | - | - |
| Subcategory | Thermal Management | - | - |
| 製造商 | 型號 | 描述 | RFQ |
|---|---|---|---|
MG Chemicals |
8329TCM-50ML | Thermal Interface Products EPOXY, MEDIUM CURE (RATIO 1:1) | |
| 8329TCS-6ML | Thermal Interface Products EPOXY, SLOW CURE (RATIO 1:1) | ||
| 8329TCS-200ML | Thermal Interface Products Thermally Conductive Two-Part, Slow Cure Epoxy Adhesive. | ||
| 8329TCM-200ML | Thermal Interface Products Thermally Conductive Two-Part, Medium Cure Epoxy Adhesive. | ||
| 8329TCS-6ML | Thermally Conductive Adhesive | ||
| 8329TCM-200ML | Thermally Conductive Adhesive | ||
| 8329TCF-50ML | Fast Cure Thermally Conductive Adhesive | ||
| 8329TFF-50ML | Fast Cure Thermally Conductive Adhesive Flowable | ||
| 8329TFF-25ML | Fast Cure Thermally Conductive Adhesive Flowable | ||
| 8329TFS-25ML | ADHESIVE, EPOXY, DUAL SYRINGE, 25ML | ||
| 8329TFM-50ML | MEDIUM CURE THERMALLY CONDUCTIVE ADHESIVE | ||
| 8329TCM-50ML | Thermally Conductive Adhesive | ||
| 8329TCF-200ML | Thermally Conductive Epoxy Adhesive, Fast Cure, 6.76 oz (200mL), Discontinued Item | ||
| 8329TCF-6ML | ADHESIVE - THERMALLY CONDUCTIVE EPOXY, FAST CURE |