 | | | |
| PartNumber | D083 | D0831 | D0831R |
| Description | |||
| Manufacturer | Harwin Inc. | - | - |
| Product Category | Sockets for ICs, Transistors | - | - |
| Series | D0 | - | - |
| Type | DIP, 0.6" (15.24mm) Row Spacing | - | - |
| Packaging | Bulk | - | - |
| Termination | Wire Wrap | - | - |
| Operating Temperature | -55°C ~ 125°C | - | - |
| Mounting Type | Through Hole | - | - |
| Features | Open Frame | - | - |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | - | - |
| Number of Positions or Pins Grid | 32 (2 x 16) | - | - |
| Pitch Mating | 0.100" (2.54mm) | - | - |
| Contact Finish Mating | Gold | - | - |
| Pitch Post | 0.100" (2.54mm) | - | - |
| Contact Finish Post | Tin | - | - |
| Contact Finish Thickness Mating | 10μin (0.25μm) | - | - |
| Contact Material Mating | Beryllium Copper | - | - |
| Contact Finish Thickness Post | 196.8μin (5.00μm) | - | - |
| Contact Material Post | Brass | - | - |
