ECB002

ECB00206 vs ECB00208-03-GP vs ECB00251ZCN-Y3

 
PartNumberECB00206ECB00208-03-GPECB00251ZCN-Y3
DescriptionLPDDR2 4G DIE 128MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB00251ZCN-Y3)
製造商 型號 描述 RFQ
ECB00206 全新原裝
ECB00208-03-GP 全新原裝
ECB00251ZCN-Y3 LPDDR2 4G DIE 128MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB00251ZCN-Y3)
ECB0027201GP 全新原裝
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