MC33290

MC33290D vs MC33290 vs MC33290DR

 
PartNumberMC33290DMC33290MC33290DR
DescriptionIC SER LNK INTER ISO KLINE 8SOICHEAT SINK, Thermal Resistance:8.8°C/W, Packages Cooled:TO-220, External Width - Metric:34.53mm, External Height - Metric:50mm, External Length - Metric:12.5mm, External Diameter - Metric:-, Hea
Manufacturer--Freescale Semiconductor - NXP
Product Category--Interface - Specialized
Series---
Type---
Packaging--Cut Tape (CT)
Package Case--8-SOIC (0.154", 3.90mm Width)
Operating Temperature---
Mounting Type--Surface Mount
Applications--Automotive
Interface--Serial
Voltage Supply--8 V ~ 18 V
Supplier Device Package--8-SOIC
Current Supply---
Number of Inputs---
Proximity Detection---
LED Driver Channels---
Resolution---
製造商 型號 描述 RFQ
MC33290DR2G 全新原裝
MC33290 HEAT SINK, Thermal Resistance:8.8°C/W, Packages Cooled:TO-220, External Width - Metric:34.53mm, External Height - Metric:50mm, External Length - Metric:12.5mm, External Diameter - Metric:-, Hea
MC33290DR 全新原裝
NXP Semiconductors
NXP Semiconductors
MC33290D IC SER LNK INTER ISO KLINE 8SOIC
MC33290DR2 IC SER LNK INTER ISO KLINE 8SOIC
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