 | | | |
| PartNumber | SIDC110D170HX1SA2 | SIDC112D170HX1SA2 | SIDC11D60SIC3 |
| Description | DIODE GEN PURP 1.7KV 200A WAFER | DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC112D170HX1SA2) | DIODE SCHOTTKY 600V 4A WAFER |
| 製造商 | 型號 | 描述 | RFQ |
|---|---|---|---|
Infineon Technologies |
SIDC110D170HX1SA2 | DIODE GEN PURP 1.7KV 200A WAFER | |
| SIDC11D60SIC3 | DIODE SCHOTTKY 600V 4A WAFER | ||
| SIDC112D170HX1SA2 | DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC112D170HX1SA2) |