XCKU3P-1FFVB676E

XCKU3P-1FFVB676E
Mfr. #:
XCKU3P-1FFVB676E
製造商:
Xilinx
描述:
FPGA - Field Programmable Gate Array
生命週期:
製造商新產品
數據表:
XCKU3P-1FFVB676E 數據表
交貨:
DHL FedEx Ups TNT EMS
支付:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
更多信息:
XCKU3P-1FFVB676E 更多信息 XCKU3P-1FFVB676E Product Details
產品屬性
屬性值
製造商:
賽靈思
產品分類:
FPGA - 現場可編程門陣列
RoHS:
Y
產品:
Kintex UltraScale+
邏輯元素數量:
355950
I/O 數量:
272 I/O
工作電源電壓:
0.85 V
最低工作溫度:
0 C
最高工作溫度:
+ 100 C
安裝方式:
貼片/貼片
包裝/案例:
FBGA-676
數據速率:
32.75 Gb/s
系列:
XCKU3P
品牌:
賽靈思
分佈式內存:
4.7 Mbit
嵌入式塊 RAM - EBR:
12.7 Mbit
濕氣敏感:
是的
收發器數量:
16 Transceiver
產品類別:
FPGA - 現場可編程門陣列
出廠包裝數量:
1
子類別:
可編程邏輯 IC
商品名:
Kintex UltraScale+
Tags
XCKU3P-1F, XCKU3P-1, XCKU3, XCKU, XCK
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ark
Fpga, Kintex Ultrascale+, Fcbga-676; Svhc:no Svhc (15-Jan-2019) Rohs Compliant: Yes
***et
FPGA Virtex UltraScale Family 355950 Cells 20nm Technology 0.95V/1V 676-Pin
***ment14 APAC
可编程逻辑芯片, FPGA, KINTEX ULTRASCALE+, FCBGA-676;
***i-Key
IC FPGA 280 I/O 676FCBGA
***nell
FPGA, KINTEX ULTRASCALE+, FCBGA-676; No. di Blocchi Logici:162720; No. di Macrocelle:355950; Famiglia FPGA:Kintex UltraScale+; Modello Case CI Logico:FCBGA; No. di Pin:676Pin; No. di Gradi di Velocità:1; Bit Totali RAM:12700Kbit; No. di I/O:280I/O; Gestione Clock:MMCM, PLL; Tensione Minima di Alimentazione Core:825mV; Tensione Massima di Alimentazione Core:876mV; Tensione di Alimentazione I/O:3.3V; Frequenza Operativa Max:667MHz; Gamma Prodotti:Kintex UltraScale+ XCKU3P Series; Sostanze Estremamente Preoccupanti (SVHC):No SVHC (15-Jan-2019)
Kintex® UltraScale+ Field Programmable Gate Arrays
Xilinx Kintex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Kintex UltraScale+ devices are ideal for both packet processing and DSP-intensive functions, and for applications ranging from wireless MIMO technology to Nx100G networking and data center.
型號 製造商 描述 庫存 價格
XCKU3P-1FFVB676E
DISTI # XCKU3P-1FFVB676E-ND
XilinxXCKU3P-1FFVB676E
RoHS: Compliant
Min Qty: 1
Container: Tray
Temporarily Out of Stock
  • 1:$1,216.8000
XCKU3P-1FFVB676E
DISTI # XCKU3P-1FFVB676E
XilinxFPGA Virtex UltraScale Family 355950 Cells 20nm Technology 0.95V/1V 676-Pin (Alt: XCKU3P-1FFVB676E)
RoHS: Compliant
Min Qty: 1
Asia - 5
  • 50:$1,300.0000
  • 25:$1,318.0000
  • 10:$1,337.0000
  • 5:$1,356.0000
  • 3:$1,376.0000
  • 2:$1,397.0000
  • 1:$1,418.0000
XCKU3P-1FFVB676E
DISTI # XCKU3P-1FFVB676E
XilinxFPGA Virtex UltraScale Family 355950 Cells 20nm Technology 0.95V/1V 676-Pin - Trays (Alt: XCKU3P-1FFVB676E)
RoHS: Compliant
Min Qty: 1
Container: Tray
Americas - 0
  • 1:$1,170.0000
XCKU3P-1FFVB676E
DISTI # XCKU3P-1FFVB676E
XilinxFPGA Virtex UltraScale Family 355950 Cells 20nm Technology 0.95V/1V 676-Pin (Alt: XCKU3P-1FFVB676E)
RoHS: Compliant
Min Qty: 1
Europe - 0
  • 1:€1,130.0000
XCKU3P-1FFVB676E
DISTI # 3132147
XilinxFPGA LOGIC ICS
RoHS: Compliant
0
  • 1:£985.6100
XCKU3P-1FFVB676E
DISTI # 3132147
XilinxFPGA LOGIC ICS
RoHS: Compliant
0
  • 1:$1,744.5300
圖片 型號 描述
XCKU3P-1SFVB784I

Mfr.#: XCKU3P-1SFVB784I

OMO.#: OMO-XCKU3P-1SFVB784I

FPGA - Field Programmable Gate Array
XCKU3P-1FFVB676E

Mfr.#: XCKU3P-1FFVB676E

OMO.#: OMO-XCKU3P-1FFVB676E

FPGA - Field Programmable Gate Array
XCKU3P-1FFVB676I

Mfr.#: XCKU3P-1FFVB676I

OMO.#: OMO-XCKU3P-1FFVB676I

FPGA - Field Programmable Gate Array
XCKU3P-1FFVA676E

Mfr.#: XCKU3P-1FFVA676E

OMO.#: OMO-XCKU3P-1FFVA676E

FPGA - Field Programmable Gate Array
XCKU3P-1FFVD900I

Mfr.#: XCKU3P-1FFVD900I

OMO.#: OMO-XCKU3P-1FFVD900I

FPGA - Field Programmable Gate Array
XCKU3P-1FFVD900E

Mfr.#: XCKU3P-1FFVD900E

OMO.#: OMO-XCKU3P-1FFVD900E-XILINX

XCKU3P-1FFVD900E
XCKU3P-1FFVA676I

Mfr.#: XCKU3P-1FFVA676I

OMO.#: OMO-XCKU3P-1FFVA676I-XILINX

XCKU3P-1FFVA676I
XCKU3P-1FFVB676I

Mfr.#: XCKU3P-1FFVB676I

OMO.#: OMO-XCKU3P-1FFVB676I-XILINX

XCKU3P-1FFVB676I
XCKU3P-1FFVD900I

Mfr.#: XCKU3P-1FFVD900I

OMO.#: OMO-XCKU3P-1FFVD900I-XILINX

XCKU3P-1FFVD900I
XCKU3P-1SFVB784E

Mfr.#: XCKU3P-1SFVB784E

OMO.#: OMO-XCKU3P-1SFVB784E-XILINX

XCKU3P-1SFVB784E
可用性
庫存:
Available
訂購:
1988
輸入數量:
XCKU3P-1FFVB676E的當前價格僅供參考,如果您想獲得最優惠的價格,請提交查詢或直接發送電子郵件至我們的銷售團隊[email protected]
參考價格(美元)
數量
單價
小計金額
1
US$1 216.69
US$1 216.69
由於2021年半導體供不應求,低於2021年之前的正常價格,請發詢價確認。
從...開始
最新產品
  • Arty A7-100T and 35T with RISC-V
    Xilinx Artix®-7 technology, featuring Digilent Arty A7, offers low power consumption, high performance, and it is able to support RISC-V and MicroBlaze™.
  • Compare XCKU3P-1FFVB676E
    XCKU3P1FFVA676E vs XCKU3P1FFVA676I vs XCKU3P1FFVB676E
  • Kintex® UltraScale™
    Xilinx's Kintex UltraScale devices provide the best price, performance, and wattage at 20 nm and include the highest signal processing bandwidth in a midrange device, next-generation transceiv
  • Virtex®-7 FPGA Development Boards
    Virtex-7 FPGAs from Xilinx are optimized for system performance and integration at 28 nm and offer best-in-class performance/watt fabric.
  • Artix-7 FPGA
    Xilinx's Artix®-7 FPGA DC and AC characteristics are specified in commercial, extended, industrial, expanded (-1Q), and military (-1M) temperature ranges.
  • Spartan®-7 FPGA Family
    Spartan-7 devices, Xilinx's addition to their cost-optimized portfolio, offer the best in class performance per watt, along with small form factor packaging.
Top