Vishay’s high current density, surface-mount, TMBS rectifiers in a low-profile SlimDPAK package with a typical height of 1.3 mm offer better thermal performance and are AEC-Q101 qualified.
SlimDPAK vs. DPAK
- 15% smaller in size
- 33% reduction in height
- 36% reduction in weight
- Double the current rating
SlimDPAK vs. D2PAK
- 15% smaller in size
- 58% reduction in height
- 86% reduction in weight
- 66% of the current rating
Features
- Very low profile, surface-mount SlimDPAK package with a typical height of 1.3 mm
- Better thermal performance (RθJM = 1.5°C/W) than DPAK (TO-252) due to 14% larger heatsink area
- Trench MOS Schottky technology provides low forward voltage drop
- High current density up to 35 A (single chip) and 40 A (dual-chip, center-tap common cathode)
- PCB footprint compatible with DPAK (TO-252)
- AEC-101 qualified
- Battery-charger units
- Frequency inverters
