By Diodes Incorporated 94
Diodes Incorporated's DESD3V3Z1BCSF is an ultra-low input capacitance (0.17 pF typical) TVS device in the data line protection product family, giving it a 66% lower insertion compared to the devices last released in the same product family. The device protects the high-speed I/O of mixed-signal systems-on-chip (SoCs) manufactured on the advanced nanometer process nodes. It features an ultra-compact (0.6 mm x 0.33 mm) footprint, 9 V breakdown voltage (VBR), 3 A maximum peak pulse current (IPP) and 4.5 V (typical) clamping voltage (VCL) per IEC61000-4-5 (8/20 µs). The DESD3V3Z1BCSF is designed to withstand reptitive ESD strikes (VESD) up to ±8 kV per IEC61000-4-2 for air and contact discharge.
DESD3V3Z1BCSF is well-suited for protecting high-speed interfaces, such as USB 3.1/3.2 (up to 20 Gbps) and Thunderbolt™ 3 (up to 40 Gbps), from possible ESD hazards. Housed in the green X2-DSN0603-2 package, the device is well-suited to fully automated manufacturing environments and easily fits into systems where space is at a premium.
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